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Author: vlsifacts

Fault Tolerance Measures

Posted on November 16, 2017June 17, 2025 By vlsifacts No Comments on Fault Tolerance Measures

Fault tolerance of electronic system is a major concern for the VLSI engineers. This can be realized from the post Need of Fault Tolerant VLSI System Design. The objective of this post is to introduce the proper tools for fault tolerance measure. A measure is a mathematical abstraction, which expresses only some subset of the object’s…

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Fault Tolerant System Design

Defects, Errors, and Faults

Posted on November 13, 2017June 17, 2025 By vlsifacts No Comments on Defects, Errors, and Faults

In Electronics industry incorrectness in products are described in several ways which may create confusion in understanding the terms defect, error and fault. Though these terms are used interchangeably in the field of VLSI testing, let’s try to draw a fine boundary between the meaning of these terms. Before doing this, we should understand why…

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Fault Tolerant System Design

Redundancy in Fault Tolerance

Posted on November 5, 2017July 1, 2025 By vlsifacts No Comments on Redundancy in Fault Tolerance

In the previous post we have understood the need of Fault Tolerance in VLSI System Design. A VLSI system can broadly be considered as a union of following 3 layers: Designers introduce several techniques to all these system layers to deal with transient as well as permanent faults, and these techniques incorporate the concept of…

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Fault Tolerant System Design

Need of Fault Tolerant VLSI System Design

Posted on October 28, 2017June 17, 2025 By vlsifacts No Comments on Need of Fault Tolerant VLSI System Design

In recent few years VLSI design has achieved remarkable growth. High performance (peta-scale) computing is a reality now and we are expecting exa-scale computing by 2020. We talk about many core processor now a days. Intel’s Xeon Phi (Knights Landing) with 72 cores and IBM’s Kilocore processors with more than 1000 cores are great examples…

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Fault Tolerant System Design

Interview Experience – Qualcomm (On Campus – #2)

Posted on July 20, 2017June 17, 2025 By vlsifacts No Comments on Interview Experience – Qualcomm (On Campus – #2)

This is an interview experience of Qualcomm, an American multinational semiconductor and telecommunications equipment company. This is an on campus placement experience and has been share by Mr. Ishaind Gupta (IIIT Delhi). As we all know that in this every second changing world a smart phone plays a very big role. A smartphone enables a…

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Interview Experience

MEMS Design Contest 2018 in association with Cadence Academic Network, X-FAB, Coventor, and Reutlingen University

Posted on September 6, 2016June 17, 2025 By vlsifacts No Comments on MEMS Design Contest 2018 in association with Cadence Academic Network, X-FAB, Coventor, and Reutlingen University

A world wide MEMS (Microelectromechanical systems) Design Contest is going to be organized in 2017-18. The Cadence Academic Network, X-FAB, Coventor, and Reutlingen University have been teamed up to build this platform which would provide the opportunity to showcase the innovative ideas. The contest is all about design and build the best MEMS and mixed-signal designs. Important Timeline December…

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MEMS, Notifications

India Innovation Challenge with support from Texas Instruments India, DST and IIMB

Posted on September 5, 2016June 17, 2025 By vlsifacts No Comments on India Innovation Challenge with support from Texas Instruments India, DST and IIMB

Texas Instruments Inc. in collaboration with Department of Science and Technology(DST) proudly announce the ‘DST & Texas Instruments Inc. India Innovation Challenge Design Contest 2016′, Anchored by the Indian Institute of Management (IIM), Bangalore and supported by MyGov. The contest is open for all students pursuing B.E./B.Tech,M.E./M.Tech & Ph.D from Indian engineering colleges. This challenge…

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Notifications

Assembly Language Program for Unpacking the Packed BCD number in 8085 Microprocessor

Posted on August 29, 2016July 1, 2025 By vlsifacts No Comments on Assembly Language Program for Unpacking the Packed BCD number in 8085 Microprocessor

Binary coded decimal (BCD) is a way to express each of the decimal digits with a binary code. This means that each decimal digit, 0 through 9, is represented by a binary code of four bits. Eg: 98 => 10011000 Unpacking the BCD number is separating each BCD digit. Eg: 98 can be separated as 09…

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8085 uP, Embedded System

Interview Experience – Qualcomm (On Campus)

Posted on August 28, 2016June 17, 2025 By vlsifacts No Comments on Interview Experience – Qualcomm (On Campus)

This is an interview experience of Qualcomm, an American multinational semiconductor and telecommunications equipment company. This is an on campus placement experience and has been share by Mr. Anuj Kumar (BITS Pilani). Hey guys… I appeared for Qualcomm Interview from Bits-Pilani, Pilani campus. It was 2 day process which included: Written Test Written test included…

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Interview, Interview Experience

Multiplication of 8-Bit Numbers in 8085 Microprocessor: Illustration of 3 Different Cases

Posted on August 26, 2016July 1, 2025 By vlsifacts No Comments on Multiplication of 8-Bit Numbers in 8085 Microprocessor: Illustration of 3 Different Cases

8085 is a very basic microprocessor with the capability of limited arithmetic and logical operations. It has dedicated arithmetic instructions for addition, subtraction, increment and decrement. If we want to perform a multiplication operation then we need to write a program for it. Multiplication is nothing but repeated addition. This post presents assembly language program…

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8085 uP, Embedded System

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